Tag Archives: ReUSE project

Honey, could you please unzip my electronics?

The UK’s National Physical Laboratory has been proceeding with an interesting project on reusable electronics, ReUSE (Reuseable, Unzippable, Sustainable Electronics), according to the Oct. 30, 2012 news item on Nanowerk,

The National Physical Laboratory (NPL), along with partners In2Tec Ltd (UK) and Gwent Electronic Materials Ltd, have developed a printed circuit board (PCB) whose components can be easily separated by immersion in hot water. …

The electronics industry has a waste problem – currently over 100 million electronic units are discarded annually in the UK alone, making it one of the fastest growing waste streams.


It was estimated in a DTI [Dept. of Trade and Industry]-funded report, that around 85% of all PCB scrap board waste goes to landfill. Around 70% of this being of non-metallic content with little opportunity for recycling. This amounts to around 1 million tonnes in the UK annually equivalent to 81 x HMS Belfasts [ships]

This revolutionary materials technology allows a staggering 90% of the original structure to be re-used. For comparison, less than 2% of traditional PCB material can be re-used. The developed technology lends itself readily to rigid, flexible and 3D structures, which will enable the electronics industry to pursue new design philosophies – with the emphasis on using less materials and improving sustainability.

Here’s a video demonstrating the technology, from the ReUSE project news page,

I had to look at this twice to confirm what I was seeing. (I worked for a company that manufactured circuit boards for its products and the idea of immersing one of those in hot water is pretty shocking to me [pun intended].)