From time to time I check out the latest on attempts to shrink computer chips. In my July 11, 2014 posting I noted IBM’s announcement about developing a 7nm computer chip and later in my July 15, 2015 posting I noted IBM’s announcement of a working 7nm chip (from a July 9, 2015 IBM news release , “The breakthrough, accomplished in partnership with GLOBALFOUNDRIES and Samsung at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE), could result in the ability to place more than 20 billion tiny switches — transistors — on the fingernail-sized chips that power everything from smartphones to spacecraft.”
I’m not sure what happened to the IBM/Global Foundries/Samsung partnership but Global Foundries recently announced that it will no longer be working on 7nm chips. From an August 27, 2018 Global Foundries news release,
GLOBALFOUNDRIES [GF] today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.
GF is realigning its leading-edge FinFET roadmap to serve the next wave of clients that will adopt the technology in the coming years. The company will shift development resources to make its 14/12nm FinFET platform more relevant to these clients, delivering a range of innovative IP and features including RF, embedded memory, low power and more. To support this transition, GF is putting its 7nm FinFET program on hold indefinitely [emphasis mine] and restructuring its research and development teams to support its enhanced portfolio initiatives. This will require a workforce reduction, however a significant number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.
I tried to find a definition for FinFet but the reference to a MOSFET and in-gate transistors was too much incomprehensible information packed into a tight space, see the FinFET Wikipedia entry for more, if you dare.
Getting back to the 7nm chip issue, Samuel K. Moore (I don’t think he’s related to the Moore of Moore’s law) wrote an Aug. 28, 2018 posting on the Nanoclast blog (on the IEEE [Institute of Electronics and Electrical Engineers] website) which provides some insight (Note: Links have been removed),
In a major shift in strategy, GlobalFoundries is halting its development of next-generation chipmaking processes. It had planned to move to the so-called 7-nm node, then begin to use extreme-ultraviolet lithography (EUV) to make that process cheaper. From there, it planned to develop even more advanced lithography that would allow for 5- and 3-nanometer nodes. Despite having installed at least one EUV machine at its Fab 8 facility in Malta, N.Y., all those plans are now on indefinite hold, the company announced Monday.
The move leaves only three companies reaching for the highest rungs of the Moore’s Law ladder: Intel, Samsung, and TSMC.
It’s a huge turnabout for GlobalFoundries. …
GlobalFoundries rationale for the move is that there are not enough customers that need bleeding-edge 7-nm processes to make it profitable. “While the leading edge gets most of the headlines, fewer customers can afford the transition to 7 nm and finer geometries,” said Samuel Wang, research vice president at Gartner, in a GlobalFoundries press release.
“The vast majority of today’s fabless [emphasis mine] customers are looking to get more value out of each technology generation to leverage the substantial investments required to design into each technology node,” explained GlobalFoundries CEO Tom Caulfield in a press release. “Essentially, these nodes are transitioning to design platforms serving multiple waves of applications, giving each node greater longevity. This industry dynamic has resulted in fewer fabless clients designing into the outer limits of Moore’s Law. We are shifting our resources and focus by doubling down on our investments in differentiated technologies across our entire portfolio that are most relevant to our clients in growing market segments.”
(The dynamic Caulfield describes is something the U.S. Defense Advanced Research Agency is working to disrupt with its $1.5-billion Electronics Resurgence Initiative. Darpa’s [DARPA] partners are trying to collapse the cost of design and allow older process nodes to keep improving by using 3D technology.)
Fabless manufacturing is where the fabrication is outsourced and the manufacturing company of record is focused on other matters according to the Fabless manufacturing Wikipedia entry.
Roland Moore-Colyer (I don’t think he’s related to Moore of Moore’s law either) has written August 28, 2018 article for theinquirer.net which also explores this latest news from Global Foundries (Note: Links have been removed),
EVER PREPPED A SPREAD for a party to then have less than half the people you were expecting show up? That’s probably how GlobalFoundries [sic] feels at the moment.
The chip manufacturer, which was once part of AMD, had a fabrication process geared up for 7-nanometre chips which its customers – including AMD and Qualcomm – were expected to adopt.
But AMD has confirmed that it’s decided to move its 7nm GPU production to TSMC, and Intel is still stuck trying to make chips based on 10nm fabrication.
Arguably, this could mark a stymieing of innovation and cutting-edge designs for chips in the near future. But with processors like AMD’s Threadripper 2990WX overclocked to run at 6GHz across all its 32 cores, in the real-world PC fans have no need to worry about consumer chips running out of puff anytime soon. µ
That’s all folks.
Maybe that’s not all
Steve Blank in a Sept. 10, 2018 posting on the Nanoclast blog (on the IEEE [Institute of Electrical and Electronics Engineers] website) provides some provocative commentary on the Global Foundries announcement (Note: A link has been removed),
For most of our lives, the idea that computers and technology would get better, faster, and cheaper every year was as assured as the sun rising every morning. The story “GlobalFoundries Halts 7-nm Chip Development” doesn’t sound like the end of that era, but for you and anyone who uses an electronic device, it most certainly is.
Technology innovation is going to take a different direction.
This story just goes on and on
There was a new development according to a Sept. 12, 2018 posting on the Nanoclast blog by, again, Samuel K. Moore (Note Links have been removed),
At an event today [sept. 12, 2018], Apple executives said that the new iPhone Xs and Xs Max will contain the first smartphone processor to be made using 7 nm manufacturing technology, the most advanced process node. Huawei made the same claim, to less fanfare, late last month and it’s unclear who really deserves the accolades. If anybody does, it’s TSMC, which manufactures both chips.
TSMC went into volume production with 7-nm tech in April, and rival Samsung is moving toward commercial 7-nm production later this year or in early 2019. GlobalFoundries recently abandoned its attempts to develop a 7 nm process, reasoning that the multibillion-dollar investment would never pay for itself. And Intel announced delays in its move to its next manufacturing technology, which it calls a 10-nm node but which may be equivalent to others’ 7-nm technology.
There’s a certain ‘soap opera’ quality to this with all the twists and turns.